Memory devices with backside bond pads under a memory array

ABSTRACT

An apparatus is provided, comprising a substrate with a frontside and a backside opposite the frontside; control circuitry disposed over the frontside of the substrate; a memory array disposed over and electrically coupled to the control circuitry; a through-silicon via (TSV) disposed under the memory array, the TSV extending through the substrate from the control circuitry to the backside of the substrate; and a bond pad disposed on the backside of the substrate and electrically coupled to the control circuitry via the TSV.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation of U.S. patent application Ser. No.16/940,040, filed Jul. 27, 2020; which is incorporated herein byreference in its entirety.

TECHNICAL FIELD

The present disclosure generally relates to memory devices, and morespecifically, relates to memory devices with backside bond pads under amemory array.

BACKGROUND

Memory devices, such as NAND devices, include an array of memory cellsand control circuitry (e.g., implemented as complementarymetal-oxide-semiconductor (CMOS circuitry) formed on an active surfaceof a semiconductor (e.g., silicon) substrate. Such memory devices caninclude bond pads through which control and data signals are provided toand from the memory device.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure will be understood more fully from the detaileddescription given below and from the accompanying drawings of variousembodiments of the disclosure.

FIGS. 1A and 1B are block diagrams illustrating a memory device in whicha bond pad is located on a frontside of a substrate outside andproximate to a memory array of the memory die.

FIGS. 2A and 2B are block diagrams illustrating a memory device in whicha bond pad is located on the frontside of the substrate over a memoryarray of the memory die.

FIGS. 3A, 3B, and 3C are block diagrams illustrating a memory device inwhich a bond pad is located on a backside of a substrate, connected tocontrol circuitry of the memory die through a TSV in accordance withsome embodiments of the present disclosure.

FIG. 4 is a flow diagram of one manufacturing processes for the memorydie of FIG. 3, in accordance with some embodiments of the presentdisclosure.

FIGS. 5A-5E are conceptual diagrams illustrating the manufacturingprocesses of FIG. 4, in accordance with some embodiments of the presentdisclosure.

FIG. 6 is a flow diagram of another manufacturing processes for thememory die of FIG. 3, in accordance with some embodiments of the presentdisclosure.

FIGS. 7A-7E are conceptual diagrams illustrating the manufacturingprocesses of FIG. 6.

DETAILED DESCRIPTION

Memory devices can include different combinations and types ofnon-volatile memory components and/or volatile memory components. Anexample of non-volatile memory components is a negative-and (NAND) typeflash memory. The memory components can include one or more arrays ofmemory cells such as single-level cells (SLCs) or multi-level cells(MLCs) (e.g., triple-level cells (TLCs) or quad-level cells (QLCs)). Insome embodiments, a particular memory component can include both an SLCportion and an MLC portion of memory cells. Each of the memory cells canstore one or more bits of data (e.g., data blocks). A memory device canfurther include control circuitry, such as CMOS circuitry, that providescontrol and data signals for the memory array and that interfaces thememory device with external components. An example control circuitry isa CMOS under array (CUA) design, where the CMOS is located between thememory array and a substrate. In some cases, a memory device can be amemory die, e.g., a device fabricated, typically with many otherdevices, on part of a silicon or other semiconductor substrate, with thecontrol circuitry and a memory array. For example, multiple memorydevices, each with control circuitry and a memory array can be formed ona single wafer and a singulation (“dicing”) process can split the wafer(e.g., by scribing and breaking, mechanical sawing, laser cutting, etc.)to separate the individual memory devices.

Aspects of the present disclosure are directed to memory dies with areduced footprint and low-stress bond pad connections. This can beachieved in memory dies by locating the bond pad for each memory die ona backside of the memory die's silicon substrate, with a through-siliconvia (TSV) electrically connecting the bond pad to the CMOS controlcircuitry, which is in disposed under the memory array. This assembly ofmemory dies does not require extra wafer space for the bond pad outsidethe footprint of the array, and prevents stress on the memory array thatcan occur if the bond pad were on a front side of the device over orproximate to the memory array.

This is contrary to conventional approaches where the bond pad is on thefrontside of the memory device, either proximate to the memory array orabove it. FIGS. 1A and 1B are block diagrams illustrating a prior artmemory die 100, in which a bond pad is located on a frontside 116 of asubstrate 102 outside and proximate to a memory array 106 of the memorydie 100. The side view of memory die 100 in FIG. 1A illustrates thesubstrate 102, control circuitry 104 on the frontside 116 of thesubstrate 102, the memory array 106 over the control circuitry 104, anda bond pad 108, which is connected to the control circuitry 104 throughconnection 110. The bond pad 108 is placed on the frontside 116 of thesubstrate 102, taking up area 112 of the substrate 102. The top view ofthe memory die 100 in FIG. 1B illustrates the frontside 116 of thesubstrate 102, with area 112 of the substrate 102 taken up by the bondpad 108. FIGS. 2A and 2B are block diagrams illustrating another priorart memory die 200, in which a bond pad 208 is located on a frontside216 of a substrate 202 over a memory array 206 of the memory die 200.The side view of the memory die 200 in FIG. 2A illustrates the substrate202, control circuitry 204, the memory array 206 over the controlcircuitry 204, and a bond pad 208 which is connected to the controlcircuitry 204 through connection 210. The bond pad 208 is placed overthe memory array 206 on the frontside 216 of the substrate 202, whichcan cause stress on the memory array 206 at point 214 (e.g., when aconnection is formed between an external component and the bond pad208). The top view of the memory die 200 in FIG. 2B illustrates thefrontside 216 of the substrate 202, with area 212, which would have beentaken up by the bond pad 108 in the configuration of FIGS. 1A and 1B,not taken up by the bond pad 208. Instead, the bond pad 208 is over thememory array 206, exposing the memory array 206 to potential stress anddamage.

FIGS. 3A, 3B, and 3C are block diagrams illustrating a memory die 300with a bond pad 308 on a backside 318 of a substrate 302. The side viewof the memory die 300 in FIG. 3A illustrates the substrate 302 (with afrontside 316 and a backside 318), control circuitry 304, a memory array306 over the control circuitry 304, and the bond pad 308 on the backside318 of the substrate 302.

In some implementations, the control circuitry 304 can be complementarymetal-oxide-semiconductor (“CMOS”) circuitry. As will be readilyapparent to one skilled in the art, the control circuitry 304 canreceive instructions from a host system and can communicate with thememory array 306, such as to transfer commands and data to (e.g., writeor erase) or transfer data from (e.g., read) one or more of the memorycells, planes, sub-blocks, blocks, or pages of the memory array. Thecontrol circuitry 304 can include, among other things, memory controlunits, circuits, firmware, integrated circuits, or other componentsconfigured to control access across the memory array 306 and to providea translation layer between the host and the memory die 300. In someimplementations, the control circuitry 304 can include a row decoder anda column decoder to decode address signals. Address signals are receivedand decoded to access memory array 306. Input/output (I/O) signals(e.g., commands, addresses, or data) can be provided to controlcircuitry 304 through TSV 314 and connection 310. Similarly, controlcircuitry 304 can output data and status information from the memory die300 through TSV 314 and connection 310. Control circuitry 304 caninclude an address register, used in conjunction with the row decoderand column decoder, to latch the address signals prior to decoding.Control circuitry 304 can include a command register and control logicto latch incoming commands and control operation of the memory die 300(e.g., controlling access to the memory array 306 in response to thecommands and generating status information for an external processor).Control circuitry 304 can also include (or be in communication with) acache register that latches data, either incoming or outgoing, totemporarily store data while the memory array 306 is busy writing orreading other data. The control circuitry 304 can also include a dataregister. During a write operation, data can be passed from the cacheregister to the data register for transfer to the memory array 306;allowing new data to be latched in the cache register. During a readoperation, control circuitry 304 can pass data through the cacheregister for output to the external processor; allowing new data to bepassed from the data register to the cache register.

The memory array 306 can include various memory configurations such as2D or 3D memory arrays. As will be readily apparent to one skilled inthe art, memory array 306 can include memory cells arranged in rows andcolumns along with access lines (e.g., wordlines) and data lines (e.g.,bitlines). The access lines and data lines may be used to transferinformation to and from the memory cells. A row decoder and a columndecoder can decode address signals on address lines to determine whichones of the memory cells are to be accessed. A sense amplifier circuitcan operate to determine the values of information read from the memorycells. Two-dimensional (2D) memory arrays are structures arranged on asurface of a semiconductor substrate. In other implementations,three-dimensional (3D) memory arrays can be employed, which can includestrings of storage cells that extend vertically, through multiplevertically spaced tiers containing respective word lines. Asemiconductor structure (e.g., a polysilicon structure) can extendadjacent a string of storage cells to form a channel for the cells ofthe string. In some cases, the polysilicon structure can be in the formof a vertically extending pillar. In other cases, the string can be“folded,” and thus arranged relative to a U-shaped pillar. In yet othercases, multiple vertical structures can be stacked upon one another toform stacked arrays of storage cell strings.

The bond pad 308 is connected to the control circuitry 304 of the memorydie 300 through a TSV 314 and connection 310. The top view of the memorydie 300 in FIG. 3B illustrates the frontside 316 of the substrate 302,with area 312, which would have been taken up by the bond pad 108 in theconfiguration of FIGS. 1A and 1B, not taken up by the bond pad 308. Thisprovides a smaller overall die footprint for memory die 300 than memorydie 100. Thus, in memory die 300, the memory array 306 extends to eachedge of the substrate 302 (or within a threshold distance of each edgeof the substrate 302) such that there is not enough room between thememory array 306 and an edge of the substrate 302 to form a bond pad ona frontside 316 thereof without overlapping the memory array 306. Asillustrated in the bottom view of the memory die 300 in FIG. 3C, thebond pad 308 is on the backside 318 of the substrate 302, allowing thesubstrate 302 to protect the memory array 306 and the control circuitry304 from potential stress and damage (e.g., associated with a bondingoperation in which an interconnect is formed or brought into contactwith the bond pad 308). In addition, there are no bond pads on thefrontside of the memory die 300. This provides a more stable and durablememory die 300 as compared to memory die 200.

Although in the present example embodiment, a memory device isillustrated with a single bond pad connected to the control circuitry bya single TSV, in other embodiments of the present disclosure memorydevices can include multiple bond pads, each connected by acorresponding one of multiple TSVs, as will be readily apparent to oneof skill in the art.

FIG. 4 is a flow diagram illustrating an example of first manufacturingprocesses 400 for the memory die 300 in accordance with someimplementations of the present technology. Although shown in aparticular sequence or order, unless otherwise specified, the order ofthe processes 400 can be modified. Thus, the illustrated embodimentsshould be understood only as examples, and the illustrated processes 400can be performed in a different order, and some of the processes 400 canbe performed in parallel. Additionally, one or more of the processes 400can be omitted in various embodiments. Thus, not all of processes 400are required in every embodiment. Other process flows are possible.FIGS. 5A-5E are conceptual diagrams 500 illustrating the firstmanufacturing processes 400 of FIG. 4. While FIGS. 5A-5E show formationof a single memory device, it will be understood that in some cases manysuch memory devices can be formed on a single wafer before the wafer issingulated to form individual memory die.

At block 402, processes 400 can form a TSV (such as TSV 314) in asubstrate 506 (e.g., a semiconductor substrate such as silicon, silicongermanium, etc.). This TSV can be placed to connect to control circuitryof the memory die. In various implementations, a cavity in thesubstrate, in which processes 400 will form the TSV, can be createdusing etching or other methods of forming or removing the semiconductormaterial. As illustrated in FIG. 5A, a cavity 502 is formed by etchingthe frontside 504 of the substrate. A TSV 508 can be formed in thecavity 502. At block 404, processes 400 can form control circuitry (suchas CMOS control circuitry 304) on the frontside of the substrate. Asfurther illustrated in FIG. 5A, control circuitry 510 is formed on thefrontside 504 of the substrate 506, connecting the TSV 508 with thecontrol circuitry 510.

At block 406, processes 400 can form a memory array (such as memoryarray 306) on the memory die over the control circuitry (e.g., on theopposite side of the control circuitry from the substrate). Asillustrated in FIG. 5B, memory array 512 is formed on the opposite side514, from the substrate 506, of the control circuitry 510. In someimplementations, forming the memory array can include forming a 3D NANDmemory array. In some implementations, as will be readily apparent toone skilled in the art, forming a 3D NAND memory array can includeforming a stack of layers of NAND memory cell structures.

At block 408, processes 400 can attach a carrier wafer on an oppositeside of the memory array from the control circuitry. As illustrated byarrow 516 between FIGS. 5B and 5C, the processes 400 can includeflipping the memory device over to set the memory device on the carrierwafer 518 or otherwise adjusting or using alternate manufacturingmachinery to work on the back side of the memory device. In otherimplementations, the carrier wafer 518 can be placed on top of thememory array 512 without flipping the memory device over or changing themanufacturing machinery. As illustrated in FIG. 5C, the carrier wafer518 is attached on the opposite side 520, from the control circuitry510, of the memory array 512.

At block 410, processes 400 can expose the TSV by planarizing a backsideof the substrate 506. Various processes can be used to remove portionsof the substrate 506, such as using mechanical or chemical etching. Asillustrated in FIG. 5D, the backside 522 of the substrate 506 isplanarized to remove portion 524 (shown as removed in FIG. 5D). Thewidth of portion 524 is sufficient to expose TSV 508 on the backside 522of the substrate 506.

At block 412, processes 400 can form a bond pad (such as bond pad 308)with the exposed TSV on the backside of the substrate 506. Asillustrated in FIG. 5E, bond pad 526 can be formed on the backside 522of the substrate 506, connecting the bond pad 526 with the TSV 508, andthrough the TSV 508 to the control circuitry 510. At block 414,processes 400 can remove the carrier wafer from the memory device, (e.g.by planarizing the carrier wafer from the memory device, or removing anadhesive connecting the carrier wafer to the memory device). As furtherillustrated in FIG. 5E, the carrier wafer 518 has been removed from thememory device.

FIG. 6 is a flow diagram illustrating an example of second manufacturingprocesses 600 for the memory die 300 in accordance with someimplementations of the present technology. Although shown in aparticular sequence or order, unless otherwise specified, the order ofthe processes 600 can be modified. Thus, the illustrated embodimentsshould be understood only as examples, and the illustrated processes 600can be performed in a different order, and some of the processes 600 canbe performed in parallel. Additionally, one or more of the processes 600can be omitted in various embodiments. Thus, not all of processes 600are required in every embodiment. Other process flows are possible.FIGS. 7A-7E are conceptual diagrams 700 illustrating the secondmanufacturing processes 600 of FIG. 6. While FIGS. 7A-7E show formationof a single memory device, it will be understood that in some cases manysuch memory devices can be formed on a single wafer before the wafer issignulated to form individual memory die.

At block 602, processes 600 can form control circuitry (such as controlcircuitry 304) on a frontside of a substrate. As illustrated in FIG. 7A,control circuitry 710 is formed on the frontside 704 of substrate 706.

At block 604, processes 600 can form a memory array (such as memoryarray 306) of the memory device over the control circuitry (e.g., on theopposite side of the control circuitry from the substrate). Asillustrated in FIG. 7B, memory array 712 is formed on the memory die onthe opposite side 714, from the substrate 706, of the control circuitry710.

At block 606, processes 600 can attach a carrier wafer to the memorydevice on an opposite side of the memory array from the controlcircuitry. As illustrated by arrow 716 between FIGS. 7B and 7C, theprocesses 600 can include flipping the memory device over to set thememory device on the carrier wafer 718 or otherwise adjusting or usingalternate manufacturing machinery to work on the opposite side of thememory device. In other implementations, the carrier wafer 718 can beplaced on top of the memory array 712 without flipping the device overor changing the manufacturing machinery. As illustrated in FIG. 7C, thecarrier wafer 718 is attached on the opposite side 720, from the controlcircuitry 710, of the memory array 712.

At block 608, processes 600 can planarize a backside of the substrate toa specified thickness. Various processes can be used to remove portionsof the substrate, such as using mechanical or chemical etching. Asillustrated in FIG. 7D, the backside 722 of the substrate 706 isplanarized to remove portion 724 (shown as removed in FIG. 7D). Thewidth of removed portion 724 is sufficient for creating a TSV throughthe remaining portion of the substrate 706.

At block 610, processes 600 can form a cavity in the substrate. Invarious implementations, the cavity in the substrate can be createdusing etching or other methods of forming or removing the semiconductormaterial. As illustrated in FIG. 7E, a cavity 702 is formed by etchingthe backside 722 of the substrate 706.

At block 612, processes 600 can form a TSV (such as TSV 314) through thecavity and form a bond pad (such as bond pad 308) on the TSV on thebackside of the substrate. The TSV can be formed to connect to controlcircuitry of the memory die. As further illustrated in FIG. 7E, a TSV708 can be formed in the cavity 702 and a bond pad 726 can be formed onthe backside 722 of the substrate 706, connecting the bond pad 726through the TSV 708 to the control circuitry 710.

At block 614, processes 600 can remove the carrier wafer from the memorydevice, e.g. by planarizing the carrier wafer from the memory device. Asfurther illustrated in FIG. 7E, the carrier wafer 718 has beenplanarized from the memory die (shown in FIG. 7E where the carrier wafer718 has been removed).

In some implementations, multiple memory devices can be formed on awafer, using the processes 400 or the processes 600, before the wafer issingulated to form multiple individual memory dies.

Although non-volatile memory components such as NAND type flash memoryare described herein, the memory components can be based on any othertype of memory such as a volatile memory. In some embodiments, thememory components can be, but are not limited to, random access memory(RAM), read-only memory (ROM), dynamic random access memory (DRAM),synchronous dynamic random access memory (SDRAM), phase change memory(PCM), magneto random access memory (MRAM), negative-or (NOR) flashmemory, electrically erasable programmable read-only memory (EEPROM),and a cross-point array of non-volatile memory cells.

In the foregoing specification, embodiments of the disclosure have beendescribed with reference to specific example embodiments thereof. Itwill be evident that various modifications can be made thereto withoutdeparting from the broader spirit and scope of embodiments of thedisclosure as set forth in the following claims. The specification anddrawings are, accordingly, to be regarded in an illustrative senserather than a restrictive sense. Those skilled in the art willappreciate that the components and blocks illustrated in FIGS. 1-7described above may be altered in a variety of ways. For example, theorder of the logic may be rearranged, substeps may be performed inparallel, illustrated logic may be omitted, other logic may be included,etc. In some implementations, one or more of the components describedabove can execute one or more of the processes described below.

Several implementations of the disclosed technology are described abovein reference to the figures. Reference in this specification to“implementations” (e.g. “some implementations,” “variousimplementations,” “one implementation,” “an implementation,” etc.) meansthat a particular feature, structure, or characteristic described inconnection with the implementation is included in at least oneimplementation of the disclosure. The appearances of these phrases invarious places in the specification are not necessarily all referring tothe same implementation, nor are separate or alternative implementationsmutually exclusive of other implementations. Moreover, various featuresare described which may be exhibited by some implementations and not byothers. Similarly, various requirements are described which may berequirements for some implementations but not for other implementations.

As used herein, being above a threshold means that a value for an itemunder comparison is above a specified other value, that an item undercomparison is among a certain specified number of items with the largestvalue, or that an item under comparison has a value within a specifiedtop percentage value. As used herein, being below a threshold means thata value for an item under comparison is below a specified other value,that an item under comparison is among a certain specified number ofitems with the smallest value, or that an item under comparison has avalue within a specified bottom percentage value. As used herein, beingwithin a threshold means that a value for an item under comparison isbetween two specified other values, that an item under comparison isamong a middle specified number of items, or that an item undercomparison has a value within a middle specified percentage range.Relative terms, such as high or unimportant, when not otherwise defined,can be understood as assigning a value and determining how that valuecompares to an established threshold. For example, the phrase “selectinga fast connection” can be understood to mean selecting a connection thathas a value assigned corresponding to its connection speed that is abovea threshold.

As used herein, the word “or” refers to any possible permutation of aset of items. For example, the phrase “A, B, or C” refers to at leastone of A, B, C, or any combination thereof, such as any of: A; B; C; Aand B; A and C; B and C; A, B, and C; or multiple of any item such as Aand A; B, B, and C; A, A, B, C, and C; etc.

Although the subject matter has been described in language specific tostructural features and/or methodological acts, it is to be understoodthat the subject matter defined in the appended claims is notnecessarily limited to the specific features or acts described above.Specific embodiments and implementations have been described herein forpurposes of illustration, but various modifications can be made withoutdeviating from the scope of the embodiments and implementations. Thespecific features and acts described above are disclosed as exampleforms of implementing the claims that follow. Accordingly, theembodiments and implementations are not limited except as by theappended claims.

Any patents, patent applications, and other references noted above areincorporated herein by reference. Aspects can be modified, if necessary,to employ the systems, functions, and concepts of the various referencesdescribed above to provide yet further implementations. If statements orsubject matter in a document incorporated by reference conflicts withstatements or subject matter of this application, then this applicationshall control.

I/We claim:
 1. An apparatus, comprising: a substrate with a frontsideand a backside opposite the frontside; control circuitry on thefrontside of the substrate; a memory array over and electrically coupledto the control circuitry; a through-silicon via (TSV) disposed under thememory array, the TSV extending through the substrate from the controlcircuitry to the backside of the substrate; and a bond pad disposed onthe backside of the substrate and electrically coupled to the controlcircuitry via the TSV, wherein the bond pad, the TSV, and the controlcircuitry are configured to provide an interface between the memoryarray and one or more external components.
 2. The apparatus of claim 1,wherein the memory array comprises a negative- and (NAND) memory array.3. The apparatus of claim 1, wherein the control circuitry comprisescomplementary metal-oxide-semiconductor (CMOS) circuitry.
 4. Theapparatus of claim 3, wherein the memory array is disposed over the CMOScontrol circuitry in a CMOS Under Array (CUA) configuration.
 5. Theapparatus of claim 1, wherein the memory array extends within athreshold distance of each edge of the substrate, the threshold distancebeing less than a width of the bond pad.
 6. The apparatus of claim 1,wherein there are no bond pads on a top side of the apparatus.
 7. Amethod for manufacturing a memory die, the method comprising: forming athrough-silicon via (TSV) in a substrate that has a frontside and abackside opposite the frontside; forming control circuitry on thefrontside of the substrate; forming a memory array over the controlcircuitry, wherein the memory array is electrically coupled to thecontrol circuitry; and forming a bond pad on the backside of thesubstrate, wherein the bond pad is electrically coupled to the controlcircuitry via the TSV for coupling the memory array to one or moreexternal components through the electrical coupling.
 8. The method ofclaim 7, further comprising singulating the memory die from a wafer. 9.The method of claim 7, further comprising, prior to forming the bondpad, attaching a carrier wafer to a top side of the memory die oppositethe backside of the substrate.
 10. The method of claim 9, furthercomprising removing the carrier wafer from the memory die, followingforming the bond pad.
 11. The method of claim 7, further comprisingexposing the TSV by planarizing the backside of the substrate.
 12. Themethod of claim 7, wherein the memory array comprises NAND memory cells.13. The method of claim 7, wherein the control circuitry iscomplementary metal-oxide-semiconductor (CMOS) circuitry.
 14. Anapparatus, comprising: a bond pad formed on a backside of a substrate,wherein the substrate has a frontside opposite the backside;complementary metal-oxide-semiconductor (CMOS) circuitry on thefrontside of the substrate; a memory array over the frontside of thesubstrate; wherein the bond pad is electrically coupled to the CMOScircuitry through a via that passes through the substrate to the CMOScircuitry and stops at a plane containing the memory array to provide anexternal interface between the memory array and one or more externalcomponents through the CMOS circuitry.
 15. The apparatus of claim 14,wherein the via is a through-silicon via (TSV).
 16. The apparatus ofclaim 14, wherein the via is vertically aligned with memory array anddoes not penetrate the memory array.
 17. The apparatus of claim 14,wherein: the memory array extends within a threshold distance of eachedge of the substrate such that the threshold distance is smaller than awidth of the bond pad; and the bond pad is vertically aligned with thememory array.
 18. The apparatus of claim 14, wherein the memory arraycomprises a NAND memory array.
 19. The apparatus of claim 14, whereinthere are no bond pads on a top side of the apparatus.
 20. The apparatusof claim 14, wherein the via does not extend away from the bond pad pastthe CMOS.